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MCP433X датащи(PDF) 66 Page - Microchip Technology

номер детали MCP433X
подробное описание детали  7/8-Bit Quad SPI Digital POT with Volatile Memory
PDF  88 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP433X датащи(HTML) 66 Page - Microchip Technology

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MCP433X/435X
DS22242A-page 66
 2010 Microchip Technology Inc.
Figure 8-8 shows possible layout implementations for
an application to support the quad and dual options on
the same PCB.
FIGURE 8-8:
Layout to support Quad and
Dual Devices.
8.4.2.3
PCB Area Requirements
In some applications, PCB area is a criteria for device
selection. Table 8-2 shows the package dimensions
and area for the different package options. The table
also shows the relative area factor compared to the
smallest area. For space critical applications, the QFN
package would be the suggested package.
8.4.3
RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-11,
Figure 2-32, Figure 2-52, and Figure 2-72.
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is RAB resistance.
8.4.4
HIGH VOLTAGE TOLERANT PINS
High voltage support (VIHH) on the Serial Interface pins
supports in-circuit accommodation of split rail
applications and power supply sync issues.
Potentiometers Devices
Rheostat Devices
MCP43X1
MCP42X1
MCP43X2
MCP42X2
TABLE 8-2:
PACKAGE FOOTPRINT (1)
Package
Package Footprint
Type
Code
Dimensions
(mm)
XY
14 TSSOP
ST
5.10
6.40 32.64 2.04
20
QFN
ML
4.00
4.00 16.00
1
TSSOP
ST
6.60
6.40 42.24 2.64
Note 1: Does not include recommended land
pattern dimensions.



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