GTL2012_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 9 August 2007

8 of 14

NXP Semiconductors

GTL2012

2-bit LVTTL to GTL transceiver

13. Package outline

Fig 8.

Package outline SOT505-1 (TSSOP8)

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.45

0.25

0.28

0.15

3.1

2.9

3.1

2.9

0.65

5.1

4.7

0.70

0.35

6

°

0

°

0.1

0.1

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT505-1

99-04-09

03-02-18

bp

D

Z

e

0.25

14

8

5

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

1.1

pin 1 index