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1

1

2

3

4

PTH05050W

6

5

C

IN

100 mF

(Required)

R

SET

1%, 0.1 W

(Required)

C

100 mF

Electrolytic

(Optional)

+

+

C

10 mF

Ceramic

(Optional)

V

OUT

GND

GND

Inhibit

V

IN

Track

ABSOLUTE MAXIMUM RATINGS

PTH05050W

SLTS213D – MAY 2003 – REVISED JUNE 2007

STANDARD APPLICATION

A.

B.

C.

D.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

voltages are with respect to GND

UNIT

Track input voltage

Operating temperature

–40

range

Surface temperature of module body or pins

AH & AD suffix

260

°C

Wave solder temperature

(5 seconds)

AS suffix

235

Solder reflow temperature

Surface temperature of module body or pins

AZ suffix

260

Storage temperature

–55

Mechanical shock

Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted

500 G

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

20 G

Weight

2.9 grams

Flammability

Meets UL94V-O

(1)

For operation below 0

°C the external capacitors must have stable characteristics. Use either a low ESR tantalum, OS-CON, or ceramic

capacitor.

(2)

During soldering of surface mount package versions, do not elevate peak temperature of the module, pins or internal components above

the stated maximum.

(3)

The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65

°C.

2

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