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LT6201CS8 датащи(PDF) 22 Page - Linear Technology |
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LT6201CS8 датащи(HTML) 22 Page - Linear Technology |
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22 / 26 page ![]() LT6200/LT6200-5 LT6200-10/LT6201 22 62001fd APPLICATIONS INFORMATION 200°C/W, θJA. Operating on ± 5V supplies driving 50Ω loads, the worst-case power dissipation is given by: PD(MAX) = (10 • 23mA) + (2.5)2/50 = 0.23 + 0.125 = 0.355W The maximum ambient temperature that the part is allowed to operate is: TA = TJ – (PD(MAX) • 200°C/W) = 150°C – (0.355W • 200°C/W) = 79°C To operate the device at a higher ambient temperature, connect more metal area to the V – pin to reduce the thermal resistance of the package, as indicated in Table 1. DD Package Heat Sinking The underside of the DD package has exposed metal (4mm2) from the lead frame where the die is attached. This provides for the direct transfer of heat from the die junction to printed circuit board metal to help control the maximum operating junction temperature. The dual-in-line pin arrangement allows for extended metal beyond the ends of the package on the topside (component side) of a PCB. Table 2 summarizes the thermal resistance from the die junction-to-ambient that can be obtained using various amounts of topside metal (2oz copper) area. On multilayer boards, further reductions can be obtained using additional metal on inner PCB layers connected through vias beneath the package. Table 2. LT6200 8-Lead DD Package COPPER AREA TOPSIDE (mm2) THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 4 160ºC/W 16 135ºC/W 32 110ºC/W 64 95ºC/W 130 70ºC/W The LT6200 amplifier family has thermal shutdown to protect the part from excessive junction temperature. The amplifier will shut down to approximately 1.2mA supply current per amplifier if the maximum temperature is exceeded. The LT6200 will remain off until the junction temperature reduces to about 135°C, at which point the amplifier will return to normal operation. |
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