MCP1790/MCP1791

DS22075A-page 4

© 2008 Microchip Technology Inc.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

VOUT .................................................. (GND-0.3V) to (+5.5V)

Internal Power Dissipation ............ Internally-Limited

(Note 4)

Output Short Circuit Current..................................Continuous

Storage temperature .....................................-55°C to +150°C

Maximum Junction Temperature .....................165°C

(Note 7)

Operating Junction Temperature...................-40°C to +125°C

ESD protection on all pins

..........≥ 6 kV HBM and ≥ 400V MM

† Notice: Stresses above those listed under “Maximum Rat-

ings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied. Expo-

sure to maximum rating conditions for extended periods may

affect device reliability.

AC/DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, V

Boldface type applies for junction temperatures, T

J (Note 5) of -40°C to +125°C.

Parameters

Symbol

Min

Typ

Max

Units

Conditions

Input Operating Voltage

6.0

—

30.0

V

< 500 ms

Input Quiescent Current

—70

130

µA

Input Quiescent Current for SHDN

Mode

—10

25

µA

SHDN = GND

Ground Current

—110

210

µA

Maximum Output Current

70

——

mA

Line Regulation

ΔV

—

±0.0002

±0.05

%/V

Load Regulation

ΔV

-0.45

±0.2

0.45

(Note 3)

Output Peak Short Circuit Current

—

A

Peak Current

Output Voltage Regulation

—

65

—

ppm/°C

Note 9

Input Voltage to Turn On Output

—5.5

6.0

V

Note 1:

2:

3:

Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is

tested over a load range from 1 mA to the maximum specified output current.

4:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained

junction temperatures above 165°C can impact the device reliability.

5:

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

ambient temperature is not significant.

6:

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

7:

Sustained junction temperatures above 165°C can impact the device reliability.

8:

The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the

short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then

the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.

9: