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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8536AVTATH датащи(PDF) 112 Page - Freescale Semiconductor, Inc |
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MPC8536AVTATH датащи(HTML) 112 Page - Freescale Semiconductor, Inc |
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112 / 128 page  MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2 Thermal Freescale Semiconductor 112 Figure 72. System Level Thermal Model for MPC8536E (Not to Scale) The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to determine the optimal grid for their specific case. Solder and Air (29 × 29 × 0.5 mm) Kx 0.034 W/m•K Ky 0.034 Kz 12.1 Table 80. MPC8536E Thermal Model (continued) Conductivity Value Units Substrate Die Bump/underfill A A Section A-A Solder/air Top View |
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