Pad Assignment

Chip size: 94

´ 98 (mil)

2

Bump height: 18

mm ± 3mm

Min. Bump spacing: 23.102

mm

Bump size: 76

´ 76mm

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

HT1622

Rev. 2.00

3

June 9, 2009

PATENTED

B Z

W R

R D

1

2 8

2

2 9

3

3 0

4

3 1

5

3 2

6

3 3

7

3 4

8

3 5

9

3 6

1 0

3 7

1 1

3 8

1 2

3 9

1 3

4 0

1 4

4 1

1 5

4 2

1 6

4 3

1 7

4 4

1 8

4 5

1 9

4 6

2 0

4 7

2 1

4 8

2 2

4 9

2 3

5 0

2 4

5 1

2 5

5 2

2 6

5 3

2 7

5 4

( 0 , 0 )

D A T A

V S S

O S C I

V D D

V L C D

B Z

T 1

T 2

T 3

C O M 0

C O M 1

C S

S E G 7

S E G 8

S E G 9

S E G 1 0

S E G 1 1

S E G 1 2

S E G 1 3

S E G 1 4

S E G 1 5

S E G 1 6

S E G 1 7

S E G 1 8

S E G 1 9

I R Q