• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

4

GaAs DPDT Switch

DC - 6.0 GHz

Rev. V3

MASW6030G

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Mounting

The MASW6030G is back-metallized with Pd/Ni/Au

(100/1,000, 10,000 Å) metallization. It can be die-

mounted with AuSn eutectic preforms or with

thermally conductive epoxy. The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

not 90/10 nitrogen/hydrogen gas is applied,

tool tip temperature should be approximately

290°C.

B. DO NOT expose the MASW6030G to a

temperature greater than 320°C for more than

20 seconds.

No more than 3 seconds for

scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place

the MASW6030G into position. A thin epoxy

fillet should be visible around the perimeter of

the chip.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy may be used by

is not required.