• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

GaAs DPDT Switch

DC - 6.0 GHz

Rev. V3

MASW6030G

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Low Insertion Loss, 0.5 dB Typical

• Fast Switching Speed, 4 ns Typical

• Ultra Low DC Power Consumption

• RoHS* Compliant

Description

MA/COM’s MASW6030G is a GaAs MMIC DPDT

switch die. The MASW6030G is ideally used where

low power consumption is required.

Typical

applications

include

transmit

/

receive

switching, switch matrices and switched filter banks,

WLAN IEEE 802.11a and 802.11 b/g systems.

Other applications include cordless phones and

base stations.

Ordering Information

Part Number

Package

MASW6030G

DIE

1

Bond Pad Dimensions

Pad Layout

Control Value (A or B)

0/-8 V

Max Input RF Power

+34 dBm

(0.5 - 6.0 GHz with 0/-8 V CTL)

Storage Temperature

-65°C to +175°C

Max Operating Temperature

+175°C

Parameter

Absolute Maximum

Absolute Maximum Rating

2,3

2. Exceeding any one or combination of these limits may cause

permanent damage to this device.

3. M/A-COM does not recommend sustained operation near

these survivability limits.

Bond Pad

Dimensions - Inches (mm)

RF1, RF6

0.005 x 0.005 (0.130 x 0.150)

RF2, RF3, RF4, RF5, A, B

0.004 x 0.004 (0.100 x 0.100)

GND

0.005 x 0.013 (0.130 x 0.320)

RF1 to

RF6 to

A

B

RF2

RF3

RF4

RF5

1

0

On

Off

On

Off

0

1

Off

On

Off

On

Truth Table

4,5

4. 0 = 0 to –0.2 V, 1 = -5 V.

5. When an RF output port is “Off” it is shorted to ground

through an “On” shunt MESFET.

Die Size - Inches (mm)

0.048 x 0.038 x 0.010 (1.220 x 0.970 x 0.250)

Schematic

*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

1. Die quantity varies.