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SMM151 датащи(PDF) 6 Page - Summit Microelectronics, Inc. |
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SMM151 датащи(HTML) 6 Page - Summit Microelectronics, Inc. |
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6 / 23 page ![]() SMM151/152 Preliminary Datasheet Summit Microelectronics, Inc 2131 2.1 8/15/2008 6 ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS Temperature Under Bias .................................-55°C to 125°C Storage Temperature QFN ..............................-65°C to 150°C Terminal Voltage with Respect to GND: VDD Supply Voltage ..................................-0.3V to 6.0V All Others ....................................... -0.3V to VDD + 0.7V FAULT#…………………………….………. GND to 15.0V CS+, CS-...………………………………… -0.3V to 16.0V Output Short Circuit Current ........................................ 100mA Reflow Solder Temperature (10 secs) .......….………....240°C Junction Temperature.........................…….....………....150°C ESD Rating per JEDEC……………………..…………....2000V Latch-Up testing per JEDEC………..……...……….… ±100mA Temperature Range (Industrial)..................... –40°C to +85°C (Commercial) ..................... 0°C to +70°C CS+, CS- ............................................................. 4.0V to 15V VDD Supply Voltage ........................................... 2.7V to 5.5V Inputs..................................................................GND to VDD Package Thermal Resistance ( θJA) 28-Pad QFN (Thermal pad connected to PCB)………37.2 oC/W 28-Pad QFN (Thermal pad not connected to PCB).…66.5 oC/W Moisture Classification Level 1 (MSL 1) per J-STD- 020 RELIABILITY CHARACTERISTICS Data Retention……………………………..……………100 Years Endurance……………………….………………...100,000 Cycles Note - The device is not guaranteed to function outside its operating rating. Stresses listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions outside those listed in the operational sections of the specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Devices are ESD sensitive. Handling precautions are recommended. DC OPERATING CHARACTERISTICS TA= 0°C to +70°C, VDD = 2.7V to 5.5V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Notes Min. Typ. Max Unit VDD Supply Voltage 2.7 3.3 5.5 V VM+ pin voltage range -0.3 VDD V VMRange Sense Voltage Common Mode Range VM- pin voltage range -0.3 +0.5 V CSRange Current Sense Common Mode Voltage Range CS+, CS- pin voltage range 4.0 15 V IDD Supply Current from VDD TRIM pin floating 3 mA TRIM Sourcing Max Current 1.5 mA ITRIM TRIM output current through 100 Ω to 1.0V TRIM Sinking Max Current -1.5 mA VTRIM TRIM output voltage range ITRIM ±1.5mA GND 2.5 V VADOC Margin Range Depends on Converter Trim range 0.3 VDD V VDD = 2.7V 0.9xVDD VDD VIH Input High Voltage SDA, SCL, WP, MUP, MDN VDD = 5.0V 0.7xVDD VDD V VDD = 2.7V 0.1xVDD VIL Input Low Voltage SDA, SCL, WP, MUP, MDN VDD = 5.0V 0.3xVDD V VOL Open Drain Output FAULT#, GPIOx, READY ISINK = 1mA 0.2 V VDD = 2.7V, Rpullup≤300kΩ 0.9xVDD VDD VAIH Address Input High Voltage, A2, A1, A0 VDD = 5.0V, Rpullup≤300kΩ 0.7xVDD VDD V VDD = 2.7V, Rpulldown≤300kΩ 0.1xVDD VAIL Address Input Low Voltage, A2, A1, A0 VDD = 5.0V, Rpulldown≤300kΩ 0.3xVDD V |
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