AD8235

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

A

B

C

D

0.657

0.602

0.546

1.61

1.57

1.53

2.08

2.04

2.00

1

2

3

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.330

0.310

0.290

1.50

REF

SEATING

PLANE

1.00

REF

0.50

REF

0.355

0.330

0.304

0.020

REF

0.280

0.250

0.220

0.230

0.212

0.192

0.348

0.328

0.308

0.04 MAX

COPLANARITY

BALL A1

IDENTIFIER

Figure 45. 11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP]

(CB-11-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8235ACBZ-P71

−40°C to + 125°C

11-Ball [WLCSP]

CB-11-1

H20

©2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D08211-0-8/09(0)