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AD8235 датащи(PDF) 16 Page - Analog Devices |
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AD8235 датащи(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() AD8235 Rev. 0 | Page 16 of 20 INCORRECT Board Thickness Typical board thicknesses used in the industry range from 0.4 mm to 1.6 mm and are most applicable for the AD8235. The thickness selected depends on the required robustness of the populated system assembly. The thinner board results in smaller shear stress range, creep shear strain range, and creep strain energy density range in the solder joints under the thermal loading. Therefore, the thinner build-up board leads to longer thermal fatigue life of solder joints [John H. Lau and S.W. Ricky Lee]1 Grounding The output voltage of the AD8235 is developed with respect to the potential on the reference terminal, REF. To ensure the most accurate output, the trace from the REF pin should either be connected to the AD8235 local ground (see Figure 39) or connected to a voltage that is referenced to the AD8235 local ground (Figure 36). REFERENCE TERMINAL The reference terminal, REF, is at one end of a 210 kΩ resistor (see Figure 35). The output of the instrumentation amplifier is referenced to the voltage on the REF terminal; this is useful when the output signal needs to be offset to voltages other than common. For example, a voltage source can be tied to the REF pin to level-shift the output so that the AD8235 can interface with an ADC. The allowable reference voltage range is a function of the gain, common-mode input, and supply voltages. The REF pin should not exceed either +VS or −VS by more than 0.5 V. For best performance, especially in cases where the output is not measured with respect to the REF terminal, source impedance to the REF terminal should be kept low because parasitic resistance can adversely affect CMRR and gain accuracy. Figure 38 demonstrates how an op amp is configured to provide a low source impedance to the REF terminal when a midscale reference voltage is desired. 1John H. Lau and S.W. Ricky Lee, “Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP),” IEEE Transactions on Components and Packaging Technologies, Vol.25, No.1, March 2002, pages 3-14. V CORRECT AD8235 REF OP AMP + – V AD8235 REF Figure 38. Driving the REF Pin POWER SUPPLY REGULATION AND BYPASSING The AD8235 has high power supply rejection ration (PSRR). However, for optimal performance, a stable dc voltage should be used to power the instrumentation amplifier. Noise on the supply pins can adversely affect performance. As in all linear circuits, bypass capacitors must be used to decouple the amplifier. A 0.1 μF capacitor should be placed close to each supply pin. A 10 μF tantalum capacitor can be used farther away from the part (see Figure 39). In most cases, it can be shared by other precision integrated circuits. AD8235 +VS +IN –IN LOAD REF –VS 0.1µF 10µF 0.1µF 10µF SDN VOUT –VS Figure 39. Supply Decoupling, REF, and Output Referred to Ground |
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