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Glossary

ST7-EMU3 series emulator

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Appendix C

Glossary

CEB (Common emulation board)

One of three boards that make up the EMU3 probe. It provides the link between the

probe and the ST Micro Connect box, and is common to all EMU3 probes.

DEB (Dedicated emulation board)

One of three boards that make up the EMU3 probe. The DEB is specific to ST7. This

board provides the link between the TEB and the CEB.

Debug module

An ST7 hardware peripheral that is able to manage instruction stepping, complex

breakpoints and abort for in-circuit debugging.

DIL (Dual In-line)

A type of device package with two rows of pins for thru-hole mounting. Sometimes also

called DIP (Dual In-line Package).

ECP (Extended capabilities port communication standard)

A parallel-port standard that supports bi-directional communication between a PC and

a peripheral device.

EEPROM (Electrically erasable programmable read-only memory)

A non-volatile type of memory that can be erased and reprogrammed by program

instructions. Since no special power supplies or ultra-violet light source is needed, the

contents of this kind of memory can be changed without removing the MCU from the

application system.

EPP (Enhanced parallel port communication standard)

A parallel port standard that supports bi-directional communication between a PC and

a peripheral device other than a printer.

EPROM (Erasable programmable read-only memory)

A non-volatile type of memory that can be erased by exposure to an ultra-violet light

source. MCUs that have EPROM are easily recognized because the package has a

quartz window to allow exposure to the UV light. If the EPROM MCU is packaged in an

opaque plastic package, it is called a “one-time programmable” OTP MCU because

there is no way to expose the EPROM to a UV light source.

Footprint

The dimensions of the location of a component on a printed circuit board or in a socket.

It depends on the number of pins, their size, type and positioning. The footprint of each

ST7 device is specified in the datasheet in the section titled Package Mechanical Data.

(Refer to the ST7 MCU FAMILY DATABOOK or the datasheets provided on the

“Microcontroller Development Tools” CD-ROM).

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