Chapter 1: DC and Switching Characteristics of HardCopy III Devices

1–7

Electrical Characteristics

© December 2008

Altera Corporation

HardCopy III Device Handbook, Volume 3

Pin Capacitance

Table 1–9 shows the HardCopy III device family pin capacitance.

Hot Socketing

Table 1–10 lists the hot socketing specifications for HardCopy III devices.

Table 1–8. On-Chip Termination Variation after Power-up Calibration – Preliminary (Note 1), (2)

Symbol

Description

V

Commercial

Typical

Unit

dR/dV

OCT variation with voltage without

re-calibration

3.0

TBD

%/mV

2.5

TBD

%/mV

1.8

TBD

%/mV

1.5

TBD

%/mV

1.2

TBD

%/mV

dR/dT

OCT variation with temperature without

re-calibration

3.0

TBD

%/°C

2.5

TBD

%/°C

1.8

TBD

%/°C

1.5

TBD

%/°C

1.2

TBD

%/°C

Note to Table 1–8:

(2) Pending silicon characterization.

Table 1–9. HardCopy III Device Capacitance – Preliminary (Note 1)

Symbol

Parameter

Typical

Unit

C

IOTB

Input capacitance on top and bottom I/O pins

TBD

pF

C

IOLR

Input capacitance on left and right I/O pins

TBD

pF

C

CLKTB

Input capacitance on top and bottom dedicated clock input pins

TBD

pF

C

CLK LR

Input capacitance on left and right dedicated clock input pins

TBD

pF

C

OUTFB

Input capacitance on dual-purpose clock output and feedback pins

TBD

pF

C

Input capacitance for dedicated clock input pins

TBD

pF

Note to Table 1–9:

(1) Pending silicon characterization.

Table 1–10. HardCopy III Hot Socketing Specifications – Preliminary (Note 1)

Symbol

Parameter

Maximum

I

IOPIN(DC )

DC current per I/O pin

300

μA

I

IOPIN(A C)

AC current per I/O pin

8 mA for

≤ 10 ns

Note to Table 1–10:

(1) Pending silicon characterization.