20

LTC1060

1060fb

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

LW/TP 1202 1K REV B • PRINTED IN USA

 LINEAR TECHNOLOGY CORPORATION 1988

J Package

20-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

OBSOLETE PACKAGE

S20 (WIDE) 0502

NOTE 3

.496 – .512

(12.598 – 13.005)

NOTE 4

20

N

19

18

17

16

15

14

13

1

23

4

5

6

78

.394 – .419

(10.007 – 10.643)

910

N/2

11

12

.037 – .045

(0.940 – 1.143)

.004 – .012

(0.102 – 0.305)

.093 – .104

(2.362 – 2.642)

.050

(1.270)

BSC

.014 – .019

(0.356 – 0.482)

TYP

0° – 8° TYP

NOTE 3

.009 – .013

(0.229 – 0.330)

.016 – .050

(0.406 – 1.270)

.291 – .299

(7.391 – 7.595)

NOTE 4

× 45°

.010 – .029

(0.254 – 0.737)

.420

MIN

.325 ±.005

RECOMMENDED SOLDER PAD LAYOUT

.045 ±.005

N

12

3

N/2

.050 BSC

.030 ±.005

TYP

.005

(0.127)

RAD MIN

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS

4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

SW Package

20-Lead Plastic Small Outline (Wide .300 Inch)

(Reference LTC DWG # 05-08-1620)

PACKAGE DESCRIPTIO

J20 0801

3

7

56

10

9

1

4

2

8

11

20

16

15

17

14

13

12

19

18

.005

(0.127)

MIN

.025

(0.635)

RAD TYP

.220 – .310

(5.588 – 7.874)

1.060

(26.924)

MAX

0° – 15°

.008 – .018

(0.203 – 0.457)

.015 – .060

(0.381 – 1.524)

.125

(3.175)

MIN

.014 – .026

(0.356 – 0.660)

.045 – .065

(1.143 – 1.651)

.100

(2.54)

BSC

.200

(5.080)

MAX

.300 BSC

(7.62 BSC)

.045 – .065

(1.143 – 1.650)

FULL LEAD

OPTION

.023 – .045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS