LM75BDP datasheet(29/29 Pages) NXP

29 / 29 page

NXP Semiconductors

LM75B

Digital temperature sensor and thermal watchdog

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 December 2008

Document identifier: LM75B_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

General operation . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

I2C-bus serial interface . . . . . . . . . . . . . . . . . . . 6

7.2.1

Bus fault time-out . . . . . . . . . . . . . . . . . . . . . . . 6

7.3

Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.4

7.4.1

Pointer register . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.4.2

Conﬁguration register . . . . . . . . . . . . . . . . . . . . 7

7.4.3

Temperature register. . . . . . . . . . . . . . . . . . . . . 8

7.4.4

Overtemperature shutdown threshold (Tos)

and hysteresis (Thyst) registers . . . . . . . . . . . . 9

7.5

OS output and polarity . . . . . . . . . . . . . . . . . . 10

7.6

OS comparator and interrupt modes . . . . . . . 10

7.7

OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . 11

7.8

Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 11

7.9

Power-up default and power-on reset . . . . . . . 11

7.10

Protocols for writing and reading the registers 12

Application design-in information . . . . . . . . . 15

8.1

Typical application. . . . . . . . . . . . . . . . . . . . . . 15

8.2

LM75A and LM75B comparison . . . . . . . . . . . 15

8.3

Temperature accuracy . . . . . . . . . . . . . . . . . . 16

8.4

Noise effect . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17

Recommended operating conditions. . . . . . . 17

Static characteristics. . . . . . . . . . . . . . . . . . . . 18

Dynamic characteristics . . . . . . . . . . . . . . . . . 20

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21

Soldering of SMD packages . . . . . . . . . . . . . . 24

14.1

Introduction to soldering . . . . . . . . . . . . . . . . . 24

14.2

Wave and reﬂow soldering . . . . . . . . . . . . . . . 24

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24

14.4

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 25

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27

Legal information. . . . . . . . . . . . . . . . . . . . . . . 28

17.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28

17.2

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

17.3

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 28

17.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Contact information . . . . . . . . . . . . . . . . . . . . 28

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

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