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STP180N55F3 датащи(PDF) 3 Page - STMicroelectronics |
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STP180N55F3 датащи(HTML) 3 Page - STMicroelectronics |
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3 / 14 page ![]() STB180N55F3 - STP180N55F3 Electrical ratings 3/14 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS=0) 55 V VGS Gate-source voltage ± 20 V ID (1) 1. Current limited by package. Drain current (continuous) at TC = 25°C 120 A ID (1) Drain current (continuous) at TC=100°C 120 A IDM (2) 2. Pulse width limited by safe operating area. Drain current (pulsed) 480 A PTOT Total dissipation at TC = 25°C 330 W Derating factor 2.2 W/°C dv/dt (3) 3. ISD < 120A, di/dt < 900A/µs, VDD < V(BR)DSS, TJ < TJMAX Peak diode recovery voltage slope 11 V/ns EAS (4) 4. Starting Tj=25°C, Id=60A, Vdd=40V (see Figure 15 and Figure 16) Single pulse avalanche energy 1000 mJ Tj Tstg Operating junction temperature storage temperature -55 To 175 °C Table 2. Thermal data Symbol Parameter TO-220 D²PAK Unit Rthj-case Thermal resistance junction-case 0.45 °C/W Rthj-a Thermal resistance junction-ambient max 62.5 -- °C/W Rthj-pcb(1) 1. When mounted on FR-4 board, on 1inch², 2oz Cu. Thermal resistance junction-ambient max -- 50 °C/W Tl Maximum lead temperature for soldering purpose 300 °C |
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