Analog Integrated Circuit Device Data

6

Freescale Semiconductor

33911

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RATINGS

Operating Ambient Temperature(11)

33911

34911

-40 to 125

-40 to 85

°C

Operating Junction Temperature

-40 to 150

°C

Storage Temperature

-55 to 150

°C

Thermal Resistance, Junction to Ambient

Natural Convection, Single Layer board (1s)(12), (13)

Natural Convection, Four Layer board (2s2p)(12), (14)

85

56

°C/W

Thermal Resistance, Junction to Case(15)

23

°C/W

Peak Package Reflow Temperature During Reflow(16), (17)

Note 17

°C

Notes

11.

The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.

12.

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

13.

Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

14.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

15.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

16.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

17.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit