L6390

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Figure 8.

DIP-16 mechanical data and package dimensions

DIP16

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

a1

0.51

0.020

B

0.77

1.65

0.030

0.065

b

0.5

0.020

b1

0.25

0.010

D

20

0.787

E

8.5

0.335

e

2.54

0.100

e3

17.78

0.700

F

7.1

0.280

I

5.1

0.201

L

3.3

0.130

Z

1.27

0.050

OUTLINE AND

MECHANICAL DATA