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ST72311R датащи(PDF) 157 Page - STMicroelectronics |
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ST72311R датащи(HTML) 157 Page - STMicroelectronics |
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157 / 164 page ![]() ST72311R, ST72511R, ST72512R, ST72532R 157/164 13.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL To solder the TQFP64 device directly on the appli- cation board, or to solder a socket for connecting the emulator probe, the application board should provide the footprint described in Figure 97. This footprint allows both configurations: s Direct TQFP64 soldering s YAMAICHI IC149-064-008-S5 socket soldering to plug either the emulator probe or an adaptor board with an TQFP64 clamshell socket. This socket is not compatible with TQFP64 package. Figure 97. TQFP64 Device And Emulator Probe Compatible Footprint Table 27. Suggested List of TQFP64 Socket Types Package / Probe Adaptor / Socket Reference Socket type TQFP64 ENPLAS OTQ-64-0.8-02 Open Top YAMAICHI IC51-0644-1240.KS-14584 Clamshell EMU PROBE YAMAICHI IC149-064-008-S5 SMC DETAIL e B * SK: Plastic socket overall dimensions. Dim mm inches Min Typ Max Min Typ Max B 0.35 0.45 0.50 0.014 0.018 0.020 E 20.80 0.819 E1 14.00 0.551 E3 11.90 12.00 12.10 0.468 0.472 0.476 e 0.75 0.80 0.85 0.029 0.031 0.033 SK* 26 1.023 Number of Pins N 64 (4x16) E E1 E3 SOCKET SK |
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