Material List of Components for RoHs

1.

hereby declares that all of or part of products, including, but not limited to, the LCM,

accessories or packages, manufactured and/or delivered to your company (including your

subsidiaries and affiliated company) directly or indirectly by our company (including our

subsidiaries or affiliated companies) do not intentionally contain any of the substances listed

in all applicable EU directives and regulations, including the following substances.

Exhibit A：The Harmful Material List

Material

(Cd)

(Pb)

(Hg)

(Cr6+)

PBBs

PBDEs

Limited

Value

100

ppm

1000

ppm

1000

ppm

1000

ppm

1000

ppm

1000

ppm

Above limited value is set up according to RoHS.

2. Process for RoHS requirement：

(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used

before.

(2) Heat-resistance temp.：

Reflow：250

,30 seconds Max.

℃

；

Connector soldering wave or hand soldering：320

, 10 seconds max.

℃

(3) Temp. curve of reflow, max. Temp.：235±5℃；

Recommended customer’s soldering temp. of connector：280

, 3 seconds.

℃

Recommendable storage

1.Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH

2.Do not place the module near organics solvents or corrosive gases.

3. Do not crush, shake, or jolt the module

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