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NSCB100AT датащи(PDF) 6 Page - List of Unclassifed Manufacturers

номер детали NSCB100AT
подробное описание детали  SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
PDF  13 Pages
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производитель  ETC2 [List of Unclassifed Manufacturers]
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NSCB100AT датащи(HTML) 6 Page - List of Unclassifed Manufacturers

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Nichia STSE-CC2008A
<Cat.No.020719>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Lead Solder
Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
120
~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature
- profile
1.
180
~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
Temperature
- profile
2.
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
350°C Max.
3 sec. Max.
(one time only)
#
After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicon resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
2.2
1.5
4.4
120sec.Max.
Pre-heating
260°C Max.
10sec. Max.
60sec.Max.
Above 220°C
1 ~ 5°C / sec.
1 ~ 5°C / sec.
180 ~ 200°C
120sec.Max.
Pre-heating
240°C Max.
10sec. Max.
60sec.Max.
Above 200
°C
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
120 ~ 150°C
<
1 : Lead Solder>
<
2 : Lead-free Solder>
(Unit : mm)



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