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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AS7343L датащи(PDF) 50 Page - ams-OSRAM AG |
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AS7343L датащи(HTML) 50 Page - ams-OSRAM AG |
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50 / 53 page  Document Feedback AS7343L Soldering & Storage Information Datasheet • PUBLIC DS001038 • v2-00 • 2022-Aug-12 52 │ 49 14 Soldering & Storage Information The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 64: Solder Reflow Profile Graph Figure 65: Solder Reflow Profile Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60 s Time above 230 °C (T2) t2 Max 50 s Time above Tpeak – 10 °C (T3) t3 Max 10 s Peak temperature in reflow Tpeak 260 °C Temperature gradient in cooling Max −5 °C/s |
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