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LPW5202

LPW5202 Rev1.7 June-2022

Reflow Soldering Profile

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat/Soak

Temperature Min(TSMIN)

Temperature Max(TSMAX)

Time(TS) from (TSMIN to TSMAX)

100°C

150°C

60~120 seconds

150°C

200°C

60~120 seconds

Ramp-up rate (TL to TP)

3°C /second max

3°C /second max

Liquidous temperature(TL)

Time(tL) maintained above TL

183°C

60~150 seconds

217°C

60~150 seconds

Peak package body temperature (TP)

For users TP must not exceed the

Classification temp in Table 1.

For suppliers TP must equal or

exceed the Classification temp in

Table 1.

For users TP must not exceed the

Classification temp in Table 2.

For suppliers TP must equal or

exceed the Classification temp in

Table 2.

Time(tP)* within 5℃ of the specified

classification temperature (TC), see

Figure 15

20* seconds

30* seconds

Ramp-down rate (TP to TL)

6°C /second max

6°C /second max

Time 25°C to peak temperature

6 minutes max

8minutes max

* Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

Table 1. Sn-Pb Eutectic Process - Classification Temperatures (TC)

Package

Thickness

Volume mm3

<350

Volume mm3

≥350

<2.5mm

235°C

220°C

≥2.5mm

220°C

220°C

Table 2. Pb-Free Process - Classification Temperatures (TC)

Package

Thickness

Volume mm3

<350

Volume mm3

350~2000

Volume mm3

≥350

<1.6mm

260°C

260°C

260°C

1.6mm~2.5mm

260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C