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LPW5202 датащи(PDF) 6 Page - Lowpower Semiconductor inc |
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LPW5202 датащи(HTML) 6 Page - Lowpower Semiconductor inc |
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6 / 14 page ![]() www.lowpowersemi.com Email: marketing@lowpowersemi.com Page 6 of 14 LPW5202 LPW5202 Rev1.7 June-2022 Parameters Symbol Test conditions Min Typ Max Unit Current limit level LPW5202Axxx ILIM Refer to Figure 14 and Equation (1) A LPW5202xxx21 VIN = 5V, VOUT = 4.5V, TA=25°C 2.10 2.30 2.50 LPW5202xxx15 VIN = 5V, VOUT = 4.5V, TA=25°C 1.4 1.6 1.8 LPW5202xxx11 VIN = 5V, VOUT = 4.5V, TA=25°C 1.20 1.35 1.50 LPW5202xxx06 VIN = 5V, VOUT = 4.5V, TA=25°C 0.55 0.65 0.75 Current limit level accuracy (3) (4) (LPW5202Axxx) ACCLIM VIN = 5V, 500mA < ILIM < 2.5A 10 % VIN = 5V, 200mA < ILIM < 500mA 15 Short circuit protection level (4) ISHORT VIN = 5V, TA=25°C 4.5 6.5 A Output auto discharge RDIS VIN = 5V, VEN = 0V 90 110 130 Ω Reverse voltage protection (3) VRVP VIN = 5V, VOUT - VIN level to trigger off 115 150 mV Enable logic high voltage level VIH VIN = 2.4V to 6V 1.4 V Enable logic high voltage level VIL VIN = 2.4V to 6V 0.4 V Leakage current on EN pin ILKG_EN VEN = VIN = 5V 3.5 μA Output logic low voltage level VOL VIN = 2.4V to 6V, IFLAGB = 10mA 0.1 V Leakage on FLAGB pin ILKG_FLAGB VIN = 5V, VFLAGB = 5V 0.1 μA FLAGB de-bounce time tDEB_FLAGB VIN = 5V, RFLAG_PU = 10kΩ, TA = 25°C, time from IOUT hits IOCP to VFLAGB = 0.1V 10 ms OCP response time (3) tOCP VIN = 5V, TA = 25°C, time from IOUT hits IOCP to IOUT stop rising 3 7 15 μs Short circuit protection time (3) tSHORT VIN = 5V, TA = 25°C, time from IOUT hits ISHORT to switch turned off 300 ns Load switch turned on delay (3) tDON VIN = 5V, ROUT = 1 0Ω, COUT = 1μF, time from enabled to VOUT = 0.5 500 μs Output rising time (3) tR VIN = 5V, ROUT = 1 0Ω, COUT = 1μF, time from VOUT = 0.1 ×VIN to 0.9×VIN 600 μs Load switch turned off delay (3) tOFF VIN = 5V, ROUT = 1 0Ω, COUT = 1μF, time from disabled to VOUT = 0.9 ×VIN 1.2 μs Output discharge time (3) tDIS VIN = 5V, ROUT = 1 0Ω, COUT = 1μF, time from VOUT = 0.9 ×VIN to 0.1×VIN 25 μs Thermal shutdown trigger TSD Temperature rising 150 °C Thermal shutdown release TSD_REL Temperature falling 130 °C Note 3. The parameter does not include the variation from external resistor on ISET. Note 4. The parameter is guaranteed by design and characterization. |
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