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FDMA1023PZ датащи(PDF) 2 Page - ON Semiconductor |
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FDMA1023PZ датащи(HTML) 2 Page - ON Semiconductor |
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2 / 9 page ![]() ©2009 Fairchild Semiconductor Corporation FDMA1023PZ Rev.C4 www.fairchildsemi.com 1 FDMA1023PZ Dual P-Channel PowerTrench® MOSFET –20V, –3.7A, 72m Features Max rDS(on) = 72m at VGS = –4.5V, ID = –3.7A Max rDS(on) = 95m at VGS = –2.5V, ID = –3.2A Max rDS(on) = 130m at VGS = –1.8V, ID = –2.0A Max rDS(on) = 195m at VGS = –1.5V, ID = –1.0A Low profile - 0.8 mm maximum - in the new package MicroFET 2x2 mm HBM ESD protection level > 2kV typical (Note 3) RoHS Compliant General Description This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features two independent P-Channel MOSFETs with low on-state resistance for minimum conduction losses. When connected in the typical common source configuration, bi-directional current flow is possible. The MicroFET 2X2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications. MOSFET Maximum Ratings T A = 25°C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units VDS Drain to Source Voltage –20 V VGS Gate to Source Voltage ±8 V ID Drain Current -Continuous (Note 1a) –3.7 A -Pulsed –6 PD Power Dissipation (Note 1a) (Note 1b) 1.5 W 0.7 TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C R JA Thermal Resistance for Single Operation, Junction to Ambient (Note 1a) 86 °C/W R JA Thermal Resistance for Single Operation, Junction to Ambient (Note 1b) 173 R JA Thermal Resistance for Dual Operation, Junction to Ambient (Note 1c) 69 R JA Thermal Resistance for Dual Operation, Junction to Ambient (Note 1d) 151 Device Marking Device Package Reel Size Tape Width Quantity 023 FDMA1023PZ MicroFET 2X2 7” 8mm 3000 units MicroFET 2X2 Pin 1 S1 G1 D2 D1 G2 S2 1 3 2 4 5 6 S1 G1 D2 D1 G2 S2 D1 D2 Free from halogenated compounds and antimony oxides July 2014 |
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