Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our
Standard Release Specification. This is a Pilot product that has been converted to high volume manufacturing and
is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
Typical Uncured Properties
8200C
Test Description
Test
Method
Filler Type
Silver
Viscosity @ 25ºC
11,500 cP
Brookfield CP51 @ 5 rpm
ATM-0018
Thixotropic Index
5.0
Viscosity @ 0.5/Viscosity @ 5 rpm
ATM-0089
Work Life @ 25ºC
24 hours
25% increase in viscosity @ RT
ATM-0087
Est. Storage Life @ -40ºC
1 year
ATM-0068
Cure Process Data
8200C
Test Description
Test
Method
Weight Loss on Cure
7%
10 x 10 mm Si die on glass slide
ATM-0031
Recommended Cure Condition
30 minutes ramp to 175ºC + 15 minutes @ 175ºC
Snap Cure Profile
Zone Number
1
2
3
4
5
6
7
Time
Temp ºC 140 150 160 200 220 220 220 120 sec
N
2 Flow
10 liters/minute @ 150ºC
Physiochemical Properties
- Post Cure
8200C
Test Description
Test
Method
Ionics
Chloride
Sodium
Potassium
< 10 ppm
< 10 ppm
< 10 ppm
Teflon flask 5 gm sample / 20-40
mesh 50 gm DI water 100ºC for
24 hours
ATM-0007
Weight Loss @ 300ºC
1%
Thermogravimetric Analysis
ATM-0073
PILOT TECHNICAL DATASHEET
ABLEBOND® 8200C
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND® 8200C low bleed die attach adhesive is
designed for small and medium sized dies across a
variety of leadframes including PPF, Cu and Ag. This
electrically conductive adhesive offers improved JEDEC
performance on QFN type packages.
02/06
Page 1 of 3
FEATURES
• HIgh electrical conductivity
• Excellent adhesion to silver and pre-plated leadframe
• Oven and snap curable
ABLEBOND 8200C adhesive is a new version of the
RP-751 series that provides improved MRT on silver
and pre-plated leadframe.
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