
8200C
Page 2 of 3
Physiochemical Properties
- Post Cure
8200C
Test Description
Test
Method
Glass Transition Temperature
190ºC
Dynamic mechanical thermal analysis ATM-0112
Coefficient of Thermal Expansion
Below Tg
60 ppm/ºC
TMA expansion mode
Above Tg
130 ppm/ºC
ATM-0055
Dynamic Tensile Modulus
@ 25ºC
4630 MPa (670,000 psi)
Dynamic
mechanical thermal
analysis using
< 0.5mm thick sample
@ 150ºC
1170 MPa (170,000 psi)
@ 250ºC
780 MPa (110,000 psi)
ATM-0112
MoistureAbsorption @ Saturation
0.20%
Dynamic vapor sorption after 85ºC/
85% RH exposure
ATM-0093
Thermal/Electrical Properties-
Post Cure
8200C
Test Description
Test
Method
Volume Resistivity
0.00017 ohm-cm
4-point probe
ATM-0020
Thermal Conductivity
1.2 W/mK
Laser Flash
ATM-0116
Mechanical Properties-
Post Cure
8200C
Test Description
Test
Method
Die Shear Strength (kg
f/die)
vs. Temperature
@25ºC
3 x 3 mm (120 x 120 mil) Si die
on SPCLF
19.1 kg
ATM-0052
Chip Warpage @ 25ºC
vs. Chip Size
Chip Size
Warpage
0.38mm (15mil)
thick Si die on
0.2mm Ag/Cu LF
7.6x7.6mm
(300 x 300 mil)
16 µm
ATM-0059
Chip Warpage
Post Dia Attach Cure
6.7 µm
Post Mold Bake (4 hrs @ 175ºC)
10.9 µm
ATM-0059
APPLICATION GUIDELINES
SHIPMENT
This Ablestik product is packed and shipped in dry ice
at -80°C. Inside every dry ice shipment of Ablestik’s
products is a small packet containing the ABLECUBE.
This is a small blue cube which retains its shape at
-40°C. If the ABLECUBE is exposed to temperatures
higher than -40°C, the cube will melt.
Please check the state of the ABLECUBE to ensure the
integrity of the shipment. If the ABLECUBE has melted
upon Receiving Inspection, place the entire shipment
in a -40°C freezer and contact your Ablestik Customer
Service or Sales Representative.
UNPACKING
Transfer the syringes from the dry ice to a -40°C freezer
without ANY delays. Freeze-thaw voids will form in
the syringes if the syringes are repeatedly thawed and
refrozen.
STORAGE
This Ablestik product must be stored at -40°C. The shelf
life of the material is only valid when the material has
been stored at the specified storage condition. Incorrect
storage conditions will degrade the performance of the
material in both handling (e.g. dispensing or screen
printing) and final cured properties.