8.4 Power Supply Recommendations

In a typical application, the high-side power supply (VDD1) for the AMC0x02R is generated from the low-side

supply (VDD2) by an isolated DC/DC converter. A low-cost option is based on the push-pull driver SN6501 and a

transformer that supports the desired isolation voltage ratings.

The AMC0x02R does not require any specific power-up sequencing. The high-side power supply (VDD1) is

decoupled with a low-ESR, 100nF capacitor (C1) parallel to a low-ESR, 1μF capacitor (C2). The low-side power

supply (VDD2) is equally decoupled with a low-ESR, 100nF capacitor (C3) parallel to a low-ESR, 1μF capacitor

(C4). Place all four capacitors (C1, C2, C3, and C4) as close to the device as possible. Figure 8-6 shows a

decoupling diagram for the AMC0x02R.

C8 100nF

Reference voltage

R2 10

R1 10

C5 10nF

AVDD

C2 1µF

C1 100nF

C6 1nF

C7 1nF

I

VDD1

GND1

INP

INN

to ADC

VDD2

VDD2

OUT

REFIN

GND2

C4 1µF

C3 100nF

Figure 8-6. Decoupling of the AMC0x02R

Verify capacitors provide adequate effective capacitance under the applicable DC bias conditions experienced in

the application. Multilayer ceramic capacitors (MLCC) typically exhibit only a fraction of the nominal capacitance

under real-world conditions. Consider this factor when selecting these capacitors. This issue is especially acute

in low-profile capacitors, where the dielectric field strength is higher than in taller components. Reputable

capacitor manufacturers provide capacitance versus DC bias curves that greatly simplify component selection.

8.5 Layout

8.5.1 Layout Guidelines

The Layout Example section details a layout recommendation with the critical placement of the decoupling

capacitors (as close as possible to the AMC0x02R supply pins). This example also depicts the placement of

other components required by the device.

8.5.2 Layout Example

Figure 8-7. Recommended Layout of the AMC0x02R

Top Metal

Inner or Bottom Layer Metal

Via

GND1

VDD1

C7

R2

C6

R1

C2

C1

Clearance area, keep free of any

conductive materials

GND2

VDD2

C3

C4

REFIN

OUT

to ADC

from MCU or external reference

INP

INN

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