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28F320C3 датащи(PDF) 39 Page - Intel Corporation |
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28F320C3 датащи(HTML) 39 Page - Intel Corporation |
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39 / 68 page ![]() Intel£ Advanced+ Boot Block Flash Memory (C3) Datasheet 39 8.0 AC Characteristics 8.1 AC Read Characteristics Table 13. Read Operations—8 Mbit Density #Sym Parameter Density 8 Mbit Unit Product 90 ns 110 ns VCC 3.0V –3.6 V 2.7 V – 3.6V 3.0V –3.6 V 2.7 V – 3.6V Note Min Max Min Max Min Max Min Max R1 tAVAV Read Cycle Time 3,4 80 90 100 110 ns R2 tAVQV Address to Output Delay 3,4 80 90 100 110 ns R3 tELQV CE# to Output Delay 1,3,4 80 90 100 110 ns R4 tGLQV OE# to Output Delay 1,3,4 30 30 30 30 ns R5 tPHQV RP# to Output Delay 3,4 150 150 150 150 ns R6 tELQX CE# to Output in Low Z 2,3,4 0 0 0 0 ns R7 tGLQX OE# to Output in Low Z 2,3,4 0 0 0 0 ns R8 tEHQZ CE#toOutput inHighZ 2,3,4 20 20 20 20 ns R9 tGHQZ OE#toOutput inHighZ 2,3,4 20 20 20 20 ns R10 tOH Output Hold from Address, CE#, or OE# Change, Whichever Occurs First 2,3,4 0 0 0 0 ns NOTES: 1. OE#may be delayeduptotELQV–tGLQV after the falling edge of CE# without impact on tELQV. 2. Sampled, but not 100% tested. 3. See Figure 8, “Read Operation Waveform” on page 42. 4. See Figure 11, “AC Input/Output Reference Waveform” on page 49 for timing measurements and maximum allowable input slew rate. |
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