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LAN8804D датащи(PDF) 80 Page - Microchip Technology

номер детали LAN8804D
подробное описание детали  4-Port Gigabit Ethernet Transceiver with QSGMII Support
PDF  89 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN8804D датащи(HTML) 80 Page - Microchip Technology

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LAN8804D
DS00003591K-page 80
© 2026 Microchip Technology Inc. and its subsidiaries
FIGURE 7-3:
128-TQFP PACKAGE (LAND PATTERN)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
9.10
9.10
MILLIMETERS
0.40 BSC
MIN
E
MAX
15.40
Contact Pad Length (X128)
Contact Pad Width (X128)
Y1
X1
1.50
0.20
NOM
C1
Contact Pad Spacing
15.40
Contact Pad to Contact Pad (X124)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X128)
G1
2.40
128-Lead Thin Quad Flat Pack (ZMX) - 14x14x1.0 mm Body [TQFP]
With 9x9 mm Grooved Exposed Pad
Microchip Technology Drawing C04-2502 Rev B
C1
C2
E
X1
Y1
G1
G2
ØV
X2
Y2
EV
EV
SILK SCREEN
1
2
332
65
96
97
128
33
64



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