LM4871 MDA MWA 3W Audio Power Amplifier With Shutdown Mode

10000840

Die Layout (C - Step)

Die/Wafer Characteristics

Fabrication Attributes

General Die Information

Physical Die Identification

LM4871C

Bond Pad Opening Size (min)

102µm x 102µm

Die Step

C

Bond Pad Metalization

0.5%

COPPER_BAL.

ALUMINUM

Physical Attributes

Passivation

NITRIDE

Wafer Diameter

150mm

Back Side Metal

BARE BACK

Dise Size (Drawn)

1372µm x 1758µm

54mils x 69mils

Back Side Connection

GND

Thickness

406µm Nominal

Min Pitch

164µm Nominal

Special Assembly Requirements:

Note: Actual die size is rounded to the nearest micron.

Die Bond Pad Coordinate Locations (C - Step)

(Referenced to die center, coordinates in µm) NC = No Connection

SIGNAL NAME

PAD# NUMBER

X/Y COORDINATES

PAD SIZE

XYX

Y

SHUTDOWN

1

-559

541

102

x

102

BYPASS

2

-559

376

102

x

102

NC

3

-559

-45

102

x

210

INPUT +

4

-559

-248

102

x

102

INPUT -

5

-559

-486

102

x

102

GND

6

-476

-725

102

x

102

VOUT 1

7

-135

-598

102

x

210

GND

8

554

-686

102

x

102

VDD

9

554

-4

102

x

210

GND

10

554

568

102

x

102

VOUT 2

11

-135

598

102

x

210

GND

12

-473

752

102

x

102

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