Typical Performance Characteristics

LM4871LD

Power Dissipation vs Output Power

LM4871LD (Note 11)

Power Derating Curve

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Note 11: This curve shows the LM4871LD’s thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane

of 1oz. Cu with an area given in the label of each curve. This label also designates whether the plane exists on the same (top) layer as the chip, on the bottom layer,

or on both layers. Infinite heatsink and unattached (no heatsink) conditions are also shown.

Typical Performance Characteristics

Non-LD Specific Characteristics

THD+N vs Frequency

THD+N vs Frequency

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