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FPD1000AS датащи(PDF) 2 Page - Filtronic Compound Semiconductors |
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FPD1000AS датащи(HTML) 2 Page - Filtronic Compound Semiconductors |
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2 / 11 page ![]() Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 2 Datasheet v3.0 FPD1000AS ABSOLUTE MAXIMUM RATING 1: PARAMETER SYMBOL TEST CONDITIONS ABSOLUTE MAXIMUM Drain-Source Voltage VDS -3V < VGS < -0.5V 7 12V Gate-Source Voltage VGS 0V < VDS < +8V -3V Drain-Source Current IDS For VDS > 2V IDSS Gate Current IG Forward or reverse current +20/-20mA RF Input Power 2 PIN Under any acceptable bias state 27.5dBm Channel Operating Temperature TCH Under any acceptable bias state 175°C Storage Temperature TSTG Non-Operating Storage -40°C to 150°C Total Power Dissipation 3 PTOT See De-Rating Note below 6W Notes: 1T Ambient = 22°C unless otherwise noted; exceeding any one of these absolute maximum ratings may cause permanent damage to the device; Users should avoid exceeding 80% of 2 or more Limits simultaneously 2Max. RF Input Limit must be further limited if input VSWR > 2.5:1 3Total Power Dissipation defined as: P TOT ≡ (PDC + PIN) – POUT, where PDC: DC Bias Power, PIN: RF Input Power, POUT: RF Output Power Total Power Dissipation to be de-rated as follows above 22 °C: PTOT= 6 - (0.04W/°C) x TPACK where TPACK= source tab lead temperature above 22°C (coefficient of de-rating formula is the Thermal Conductivity) Example: For a 55 °C carrier temperature: P TOT = 6W – (0.04 x (55 – 22)) = 4.68W 5For optimum heatsinking, metal-filled through (Source) via holes should be used directly below the central metallized ground pad on the bottom of the package 6Thermal Resistivity: The nominal value of 25 °C/W is measured with the package mounted on a large heatsink with thermal compound to ensure adequate (unsoldered) contact. The package temperature is referred to the Source leads. 7 Operating at absolute maximum VD continuously is not recommended. If operation is considered then IDS must be reduced in order to keep the part within it's thermal power dissipation limits. Therefore VGS is restricted to <-0.5V. BIASING GUIDELINES: • Active bias circuits provide good performance stabilization over variations of operating temperature, but require a larger number of components compared to self-bias or dual-biased. Such circuits should include provisions to ensure that Gate bias is applied before Drain bias, otherwise the pHEMT may be induced to self-oscillate. Contact your Sales Representative for additional information. • Dual-bias circuits are relatively simple to implement, but will require a regulated negative voltage supply for depletion-mode devices such as the FPD1000AS. • The recommended 200mA bias point is nominally a Class AB mode. A small amount of RF gain expansion prior to the onset of compression is normal for this operating point. RECOMMENDED OPERATING BIAS CONDITIONS : • Drain-Source Voltage: From 5V to 10V • Quiescent Current: From 25% IDSS to 55% IDSS |
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