Final datasheet

13

Rev.2.9

2024-05-16

EiceDRIVER™ 2EDi product family

2EDSx reinforced, 2EDFx functional isolated 4A/8A, 1A/2A gate drivers

Device characteristics

4.2

Thermal characteristics

Table 6

Thermal characteristics at Tamb= 25°C

Parameter

Symbol

Values

Unit Note or

Test Condition

Min.

Typ.

Max.

PG-TFLGA-13-4

Thermal resistance junction-

ambient 1)

1) Obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in

JESD51-2a

RthJA25

–

134

–

K/W –

Thermal resistance junction-case

(top) 2)

2) Obtained by simulating a cold plate test on the package top. No specific JEDEC standard test exists, but a close

description can be found in the ANSI SEMI standard G30-88

RthJC25

–55–

K/W –

Thermal resistance junction-board 3)

3) Obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in

JESD51-8

RthJB25

–73–

K/W –

Characterization parameter

junction-top 4)

4) Estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining

Rth, using a procedure described in JESD51-2a (sections 6 and 7)

ΨthJT25

–8–

K/W –

Characterization parameter

junction-board 4)

ΨthJB25

–70–

K/W –

PG-DSO-16-11

Thermal resistance junction-

ambient 1)

RthJA25

–51–

K/W –

Thermal resistance junction-case

(top) 2)

RthJC25

–25–

K/W –

Thermal resistance junction-board 3)

RthJB25

–36–

K/W –

Characterization parameter

junction-top 4)

ΨthJT25

–4.4

–

K/W –

Characterization parameter

junction-board 4)

ΨthJB25

–5.4

–

K/W –

PG-DSO-16-30

Thermal resistance junction-

ambient 1)

RthJA25

–59–

K/W –

Thermal resistance junction-case

(top) 2)

RthJC25

–32–

K/W –

Thermal resistance junction-board 3)

RthJB25

–33–

K/W –

Characterization parameter

junction-top 4)

ΨthJT25

–8.9

–

K/W –

Characterization parameter

junction-board 4)

ΨthJB25

–7.7

–

K/W –