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TDA2SXABC датащи(PDF) 4 Page - Texas Instruments

номер детали TDA2SXABC
подробное описание детали  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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TDA2SXABC датащи(HTML) 4 Page - Texas Instruments

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TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
www.ti.com
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Table of Contents
Copyright © 2015–2019, Texas Instruments Incorporated
Table of Contents
1
Device Overview
......................................... 1
1.1
Features
.............................................. 1
1.2
Applications
........................................... 2
1.3
Description
............................................ 2
1.4
Functional Block Diagram
........................... 3
2
Revision History
......................................... 5
3
Device Comparison
..................................... 6
3.1
Related Products
..................................... 8
4
Terminal Configuration and Functions
.............. 9
4.1
Terminal Assignment
................................. 9
4.2
Ball Characteristics
.................................. 10
4.3
Multiplexing Characteristics
......................... 77
4.4
Signal Descriptions
.................................. 95
5
Specifications
......................................... 136
5.1
Absolute Maximum Ratings
........................ 136
5.2
ESD Ratings
....................................... 137
5.3
Power on Hour (POH) Limits
...................... 138
5.4
Recommended Operating Conditions
............. 138
5.5
Operating Performance Points
..................... 142
5.6
Power Consumption Summary
.................... 158
5.7
Electrical Characteristics
........................... 158
5.8
Thermal Resistance Characteristics
............... 167
5.9
Power Supply Sequences
......................... 168
6
Clock Specifications
................................. 177
6.1
Input Clock Specifications
......................... 178
6.2
RC On-die Oscillator Clock
........................ 186
6.3
DPLLs, DLLs Specifications
....................... 186
7
Timing Requirements and Switching
Characteristics
........................................ 191
7.1
Timing Test Conditions
............................ 191
7.2
Interface Clock Specifications
..................... 191
7.3
Timing Parameters and Information
............... 191
7.4
Recommended Clock and Control Signal Transition
Behavior
............................................ 193
7.5
Virtual and Manual I/O Timing Modes
............. 193
7.6
Video Input Ports (VIP)
............................ 196
7.7
Display Subsystem – Video Output Ports
......... 214
7.8
Display Subsystem – High-Definition Multimedia
Interface (HDMI)
................................... 226
7.9
External Memory Interface (EMIF)
................. 226
7.10
General-Purpose Memory Controller (GPMC)
..... 226
7.11
Timers
.............................................. 248
7.12
Inter-Integrated Circuit Interface (I2C)
............. 249
7.13
Universal Asynchronous Receiver Transmitter
(UART)
............................................. 252
7.14
Multichannel Serial Peripheral Interface (McSPI)
. 253
7.15
Quad Serial Peripheral Interface (QSPI)
.......... 259
7.16
Multichannel Audio Serial Port (McASP)
.......... 264
7.17
Universal Serial Bus (USB)
........................ 284
7.18
Serial Advanced Technology Attachment (SATA)
. 286
7.19
Peripheral Component Interconnect Express
(PCIe)
.............................................. 286
7.20
Controller Area Network Interface (DCAN)
........ 287
7.21
Ethernet Interface (GMAC_SW)
................... 287
7.22
eMMC/SD/SDIO
................................... 298
7.23
General-Purpose Interface (GPIO)
................ 324
7.24
System and Miscellaneous interfaces
............. 325
7.25
Test Interfaces
..................................... 325
8
Applications, Implementation, and Layout
...... 329
8.1
Introduction
........................................ 329
8.2
Power Optimizations
............................... 330
8.3
Core Power Domains
.............................. 344
8.4
Single-Ended Interfaces
........................... 356
8.5
Differential Interfaces
.............................. 358
8.6
Clock Routing Guidelines
.......................... 379
8.7
DDR2/DDR3 Board Design and Layout
Guidelines
.......................................... 381
9
Device and Documentation Support
.............. 416
9.1
Device Nomenclature and Orderable Information
. 416
9.2
Tools and Software
................................ 418
9.3
Documentation Support
............................ 419
9.4
Related Links
...................................... 419
9.5
Community Resources
............................. 420
9.6
Trademarks
........................................ 420
9.7
Electrostatic Discharge Caution
................... 420
9.8
Glossary
............................................ 420
10
Mechanical, Packaging, and Orderable
Information
............................................. 421
10.1
Packaging Information
............................. 421



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