9

TUSB8041

www.ti.com

SLLSEE4E – JUNE 2014 – REVISED JUNE 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage Range

VDD Steady-state supply voltage

–0.3

1.4

V

VDD33 Steady-state supply voltage

–0.3

3.8

V

Voltage Range

USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1],

USB_SSRXN_DP[4:1] and USB_VBUS terminals

-0.3

1.4

V

XI terminals

-0.3

2.45

V

All other terminals

-0.3

3.8

V

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD(1)

1.1V supply voltage

0.99

1.1

1.26

V

VDD33

3.3V supply voltage

3

3.3

3.6

V

USB_VBUS

Voltage at USB_VBUS PAD

0

1.155

V

TA

Operating free-air temperature

TUSB8041

0

70

°C

TUSB8041I

–40

85

°C

TJ

Operating junction temperature

–40

105

°C