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EXAMPLE BOARD LAYOUT

6X (0.5)

(R0.05) TYP

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

7X (0.7)

8X (0.25)

(1.7)

(0.8)

WSON - 0.8 mm max height

DQF0008A

PLASTIC SMALL OUTLINE - NO LEAD

4220563/A 03/2021

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 30X

SEE SOLDER MASK

DETAIL

1

4

5

8

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS