Figure 5. Relative variations of dynamic parameters

versus junction temperature (reference: Tj = 125 °C)

25

50

75

100

125

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

T (°C)

j

S factor

IRM

Figure 6. Transient peak forward voltage versus dIF/dt

(90% confidence)

0

50

100

150

200

250

300

350

400

450

500

0

1

2

3

4

5

6

7

8

V

(V)

FP

dI /dt(A/µs)

F

I =I

T =125°C

F

F(AV)

j

Figure 7. Forward recovery versus dIF/dt (90%

confidence)

0

50

100

150

200

250

300

350

400

450

500

0

50

100

150

200

250

300

t ( ns)

fr

dI /dt(A/µs)

F

I =I

T =125°C

F

F(AV)

j

V =1.1 x V max.

FR

F

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab (typical values)

0

10

20

30

40

50

60

70

80

90

100

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

DPAK

Epoxy printed circuit board, copper thickness: 35 µm

STTH1003S-Y

Characteristics

DS8767 - Rev 4

page 5/10