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TLV759P датащи(PDF) 4 Page - Texas Instruments |
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TLV759P датащи(HTML) 4 Page - Texas Instruments |
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4 / 32 page ![]() 4 TLV759P SBVS352A – APRIL 2018 – REVISED DECEMBER 2018 www.ti.com Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 (1) Minimun derated capacitance of 0.47 μF is required for stability 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 1.5 6.0 V VOUT Output voltage 0.55 5.5 V IOUT Output current 0 1 A CIN Input capacitor 1 μF COUT Output capacitor(1) 1 220 μF VEN Enable voltage 0 6.0 V fEN Enable toggle frequency 10 kHz TJ Junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TLV759 UNIT DRV (WSON) 6 PINS RθJA Junction-to-ambient thermal resistance 80.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 98.7 °C/W RθJB Junction-to-board thermal resistance 44.8 °C/W ψJT Junction-to-top characterization parameter 6.1 °C/W ψJB Junction-to-board characterization parameter 45.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 20.8 °C/W (1) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included (2) VIN = 1.5V for VOUT < 1.0 V 6.5 Electrical Characteristics at operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF, unless otherwise noted. All typical values at TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VFB Feedback voltage TJ = 25°C 0.55 V Output accuracy(1) TJ = 25°C –0.7% 0.7% –40°C ≤ TJ ≤ +85°C –1% 1% –40°C ≤ TJ ≤ +125°C –1.5% 1.5% Line regulation VOUT(NOM) + 0.5 V (2) ≤ V I N ≤ 6.0 V 2 7.5 mV Load regulation 0.1 mA ≤ IOUT ≤ 1 A, VIN ≥ 2.0 V 0.03 V/A IGND Ground current IOUT = 0 mA TJ = 25°C 10 25 31 µA –40°C ≤ TJ ≤ +125°C 35 ISHDN Shutdown current VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V 0.1 1 µA |
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