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TLV759P датащи(PDF) 4 Page - Texas Instruments

номер детали TLV759P
подробное описание детали  TLV759P 1-A High Accuracy Adjustable LDO in a Small Size Package
PDF  32 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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TLV759P датащи(HTML) 4 Page - Texas Instruments

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TLV759P
SBVS352A – APRIL 2018 – REVISED DECEMBER 2018
www.ti.com
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1)
Minimun derated capacitance of 0.47 μF is required for stability
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
1.5
6.0
V
VOUT
Output voltage
0.55
5.5
V
IOUT
Output current
0
1
A
CIN
Input capacitor
1
μF
COUT
Output capacitor(1)
1
220
μF
VEN
Enable voltage
0
6.0
V
fEN
Enable toggle frequency
10
kHz
TJ
Junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TLV759
UNIT
DRV (WSON)
6 PINS
RθJA
Junction-to-ambient thermal resistance
80.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
98.7
°C/W
RθJB
Junction-to-board thermal resistance
44.8
°C/W
ψJT
Junction-to-top characterization parameter
6.1
°C/W
ψJB
Junction-to-board characterization parameter
45.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
20.8
°C/W
(1)
When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included
(2)
VIN = 1.5V for VOUT < 1.0 V
6.5 Electrical Characteristics
at operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever is greater), IOUT = 1 mA,
VEN = VIN, and CIN = COUT = 1 μF, unless otherwise noted. All typical values at TJ = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VFB
Feedback voltage
TJ = 25°C
0.55
V
Output accuracy(1)
TJ = 25°C
–0.7%
0.7%
–40°C
≤ TJ ≤ +85°C
–1%
1%
–40°C
≤ TJ ≤ +125°C
–1.5%
1.5%
Line regulation
VOUT(NOM) + 0.5 V
(2) ≤ V
I N ≤ 6.0 V
2
7.5
mV
Load regulation
0.1 mA
≤ IOUT ≤ 1 A, VIN ≥ 2.0 V
0.03
V/A
IGND
Ground current
IOUT = 0 mA
TJ = 25°C
10
25
31
µA
–40°C
≤ TJ ≤ +125°C
35
ISHDN
Shutdown current
VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V
0.1
1
µA



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