Table 6. HU3PAK package mechanical data

Ref.

Dimensions

mm

Min.

Typ.

Max.

A

3.40

3.50

3.60

A1

0.05

b

0.50

0.60

0.70

b2

0.50

0.70

1.00

b3

0.80

0.90

1.00

c

0.40

0.50

0.60

c2

0.40

0.50

0.60

D

11.70

11.80

11.90

D1

8.80

8.955

9.10

E

13.90

14.00

14.10

E1

12.30

12.40

12.50

E2

7.75

7.80

7.85

e

BSC 1.27

H

18.00

18.58

19.00

L

2.40

2.52

2.60

L1

3.05

L2

0.90

1.00

1.10

L3

BSC 0.26

L4

0.075

0.125

0.175

L5

1.83

1.93

2.03

L6

2.14

2.24

2.34

L7

4.44

4.54

4.64

aaa

0.10

F1

2.90

3.00

3.10

F2

2.40

2.50

2.60

F3

0.25

0.35

0.45

N1

3.80

3.90

4.00

N2

0.25

0.30

0.45

N3

0.80

0.90

1.00

T

0.50

0.67

0.70

T2

9.18

9.38

9.43

θ1

0°

8°

θ2

0°

8°

1. Package outline exclusive of any mold flashes dimensions.

2. Package outline exclusive of burr dimensions.

3. Max resin gate protrusion: 0.25 mm.

4. The planarity of the package backside 50 micron max.

5. BSC: basic spacing between centers

STPSC30G065L2Y

Package information

DS14984 - Rev 1

page 7/11