ONET1130EC datasheet(6/64 Pages) TI2

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ONET1130EC

SLLSEJ3A – JUNE 2015 – REVISED JULY 2015

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7.4 Thermal Information

RSM (VQFN)

THERMAL METRIC(1)

UNIT

32 PINS

RθJA

Junction-to-ambient thermal resistance

37.2

°C/W

RθJCtop

Junction-to-case (top) thermal resistance

30.1

°C/W

RθJB

Junction-to-board thermal resistance

7.8

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

7.6

°C/W

RθJCbot

Junction-to-case (bottom) thermal resistance

2.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 DC Electrical Characteristics

Over recommended operating conditions, open loop operation, VOUT = 2 VPP single-ended, I(BIAS) = 80 mA, unless otherwise

noted. Typical operating condition is at VCC = 2.5 V and TA = 25°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VCC

Supply voltage

2.37

2.5

2.63

Supply current in single-ended TX

225

266

TXMODE = 1, TXCDR_DIS = 0, TX VOUT = 2 VPP single-

mode with CDRs enabled

ended, I(BIAS) = 0 mA; RXCDR_DIS = 0, 600 mVPP

Power dissipation in single-ended TX differential RX output

563

699

mode with CDRs enabled

Supply current in differential TX

270

310

TXMODE = 0, TXCDR_DIS = 0, TX VOUT = 1.8 VPP

mode with CDRs enabled

single-ended, I(BIAS) = 0 mA; RXCDR_DIS = 0, 600 mVPP

Power dissipation in differential TX

differential RX output

675

815

mode with CDRs enabled

IVCC

Supply current in single-ended TX

161

185

TXMODE = 1, TXCDR_DIS = 1, TX VOUT = 2 VPP single-

mode with CDRs disabled

ended, I(BIAS) = 0 mA; RXCDR_DIS = 1, 600 mVPP

Power dissipation in single-ended TX differential RX output

403

487

mode with CDRs disabled

Supply current in differential TX

206

242

TXMODE = 0, TXCDR_DIS = 1, TX VOUT = 1.8 VPP

mode with CDRs disabled

single-ended, I(BIAS) = 0 mA; RXCDR_DIS = 1, 600 mVPP

Power dissipation in differential TX

differential RX output

515

636

mode with CDRs disabled

R(TXIN)

Transmitter data input resistance

Differential between TXIN+ / TXIN–

100

Transmitter data input termination

mismatch

R(RXIN)

Receiver data input resistance

Differential between RXIN+ / RXIN–

100

R(OUT)

Transmitter output resistance

Single-ended at TXOUT+ or TXOUT–

R(RXOUT)

Receiver data output resistance

Differential between RXOUT+ or RXOUT–

Receiver data output termination

mismatch

Digital input current

TX_DIS, RX_DIS pull up to VCC

–20

µA

LOL, TX_FLT, RX_LOS, pull-up to VCC,

VOH

Digital output high voltage

2.1

ISOURCE = 37.5 μA

LOL, TX_FLT, RX_LOS, pull-up to VCC,

VOL

Digital output low voltage

0.4

ISINK = 350 μA

I(BIAS-MIN)

Minimum bias current

See (1)

Source. BIASPOL = 0, DAC set to maximum, open and

145

150

closed loop

I(BIAS-MAX)

Maximum bias current

Sink. BIASPOL = 1, DAC set to maximum, open and

100

closed loop

I(BIAS-DIS)

Bias current during disable

100

µA

Average power stability

APC loop enabled

±0.5

Source. TXBIASPOL = 0

VCC-0.45

Bias pin compliance voltage

Sink. TXBIASPOL = 1

0.45

Temperature sensor accuracy

With 1-point external mid-scale calibration

±3

°C

(1)

The bias current can be set below the specified minimum according to the corresponding register setting; however, in closed loop

operation settings below the specified value may trigger a fault.

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