LP3871, LP3874

SNVS225H – FEBRUARY 2003 – REVISED JUNE 2015

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Table of Contents

7.4

Device Functional Modes.......................................... 9

1

Features .................................................................. 1

8

Application and Implementation ........................ 11

2

Applications ........................................................... 1

8.1

Application Information............................................ 11

3

Description ............................................................. 1

8.2

Typical Applications ............................................... 11

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 16

5

Pin Configuration and Functions ......................... 3

9.1

Power Dissipation .................................................. 16

6

Specifications......................................................... 4

10

Layout................................................................... 16

6.1

Absolute Maximum Ratings ...................................... 4

10.1

Layout Guidelines ................................................. 16

6.2

ESD Ratings.............................................................. 4

10.2

Layout Examples................................................... 16

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 17

6.4

Thermal Information .................................................. 4

11.1

Related Links ........................................................ 17

6.5

Electrical Characteristics........................................... 5

11.2

Community Resources.......................................... 17

6.6

Typical Characteristics .............................................. 7

11.3

Trademarks ........................................................... 17

7

Detailed Description .............................................. 8

11.4

Electrostatic Discharge Caution ............................ 17

7.1

Overview ................................................................... 8

11.5

Glossary ................................................................ 17

7.2

Functional Block Diagrams ....................................... 8

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................... 8

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (April 2013) to Revision H

Page

•

Added Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes,

Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support ,

and Mechanical, Packaging, and Orderable Information sections; conform pin names in graphics to TI nomenclature....... 1

•

Deleted Lead temperature row - information in POA ............................................................................................................ 4

•

Deleted Heatsinking subsections regarding specific packages as specs have been updated (see Thermal

Information). ......................................................................................................................................................................... 16

•

Changed layout examples to eliminate obsolete thermal-value references ........................................................................ 16

Changes from Revision F (April 2013) to Revision G

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 16

2

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