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STM32L443CC датащи(PDF) 93 Page - STMicroelectronics

номер детали STM32L443CC
подробное описание детали  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, LCD, analog, audio, AES
PDF  215 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
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STM32L443CC датащи(HTML) 93 Page - STMicroelectronics

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DS11421 Rev 4
93/215
STM32L443CC STM32L443RC STM32L443VC
Electrical characteristics
185
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 22 are derived from tests performed under the ambient
temperature condition summarized in Table 21.
The requirements for power-up/down sequence specified in Section 3.9.1: Power supply
schemes must be respected.
6.3.3
Embedded reset and power control block characteristics
The parameters given in Table 23 are derived from tests performed under the ambient
temperature conditions summarized in Table 21: General operating conditions.
TA
Ambient temperature for the
suffix 6 version
Maximum power dissipation
–40
85
°C
Low-power dissipation(5)
–40
105
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
Low-power dissipation(5)
–40
125
Ambient temperature for the
suffix 3 version
Maximum power dissipation
–40
125
Low-power dissipation(5)
–40
130
TJ
Junction temperature range
Suffix 6 version
–40
105
°C
Suffix 7 version
–40
125
Suffix 3 version
–40
130
1. When RESET is released functionality is guaranteed down to VBOR0 Min.
2. This formula has to be applied only on the power supplies related to the IO structure described by the pin definition table.
Maximum I/O input voltage is the smallest value between Min(VDD, VDDA, VDDUSB, VLCD)+3.6 V and 5.5V.
3. For operation with voltage higher than Min (VDD, VDDA, VDDUSB, VLCD) +0.3 V, the internal Pull-up and Pull-Down resistors
must be disabled.
4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.9: Thermal characteristics).
5. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.9:
Thermal characteristics).
Table 21. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Table 22. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
-
0
∞
µs/V
VDD fall time rate
10
∞
tVDDA
VDDA rise time rate
-
0
∞
VDDA fall time rate
10
∞
tVDDUSB
VDDUSB rise time rate
-
0
∞
VDDUSB fall time rate
10
∞



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