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LM5145 датащи(PDF) 64 Page - Texas Instruments |
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LM5145 датащи(HTML) 64 Page - Texas Instruments |
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64 / 66 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 20X (0.6) 20X (0.25) 14X (0.5) (1.7) (2.7) (4.3) (0.75) TYP (1.1) (3.3) (0.6) (R0.05) TYP VQFN - 1 mm max height RGY0020G PLASTIC QUAD FLATPACK - NO LEAD 4229343/A 01/2023 SYMM 1 9 10 11 12 2 19 20 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X 21 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL |
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