6.7 Safety-Related Certifications

VDE

CSA

UL

CQC

Plan to certify according to DIN V

VDE V 0884-11:2017- 01

Plan to certify according to IEC

60950-1, IEC 62368-1

Plan to certify according to UL

1577 Component Recognition

Program

Plan to certify according to

GB4943.1-2011

Maximum transient isolation

voltage,

4242 VPK;

Maximum repetitive peak

isolation voltage,

637 VPK;

Maximum surge isolation voltage,

5000 VPK

400 VRMS basic insulation

working voltage per CSA

60950-1-07+A1+A2 and IEC

60950-1 2nd Ed., for pollution

degree 2, material group I

Single protection,

3000 VRMS

Basic Insulation, Altitude ≤ 5000

m, Tropical Climate, 400 VRMS

maximum working voltage

Certificate planned

Certificate planned

Certificate planned

Certificate planned

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output

circuitry.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SOIC-8 PACKAGE

IS

Safety input, output, or supply current

RθJA = 119.5 °C/W, VI = 5.5 V, TJ =

150°C, TA = 25°C, see Figure 6-1

190

mA

RθJA = 119.5 °C/W, VI = 3.6 V, TJ =

150°C, TA = 25°C, see Figure 6-1

290

mA

RθJA = 119.5 °C/W, VI = 2.75 V, TJ =

150°C, TA = 25°C, see Figure 6-1

380

mA

RθJA = 119.5 °C/W, VI = 1.89 V, TJ =

150°C, TA = 25°C, see Figure 6-1

553

mA

PS

Safety input, output, or total power

RθJA = 119.5 °C/W, TJ = 150°C, TA =

25°C, see Figure 6-2

1044

mW

TS

Maximum safety temperature

150

°C

(1)

The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS

and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be

exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount

packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.

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ISO1044

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