7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

V±

Single supply, (V+) to (V–)

36

V

Dual supply, (V+) – (V–)

±18

IIN

Input current

10

mA

IS

Output short circuit (to ground)

Continuous

TA

Operating temperature

–55

125

°C

TJ

Junction temperature

–55

125

°C

Tstg

Storage temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings

only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Section 7.3.

Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V±

Supply voltage

Single supply, VS = (V+)

4.5

36

V

Dual supply, VS = (V+) – (V–)

±2.25

±18

TA

Specified temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA592

UNIT

D

DGK

DRC

8 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

115

158

47.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.4

48.6

49.6

°C/W

RθJB

Junction-to-board thermal resistance

59.2

78.7

21.0

°C/W

ψJT

Junction-to-top characterization parameter

9.5

3.9

0.8

°C/W

ψJB

Junction-to-board characterization parameter

58.3

77.3

20.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

5.3

5.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA592

SBOS914F – OCTOBER 2018 – REVISED APRIL 2021

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