8 Device and Documentation Support

8.1 Documentation Support

8.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Generic ESD Device Evaluation Module

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (October 2023) to Revision C (June 2025)

Page

• Separated pinout information into two tables..................................................................................................... 3

Changes from Revision A (December 2022) to Revision B (October 2023)

Page

• Updated the Package Information table to include package size.......................................................................1

• Changed voltage to power in the Surge Curve (IEC 61000-4-5, tp=8/20µs), I/O Pin to GND figure.................. 6

Changes from Revision * (July 2018) to Revision A (December 2022)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Added the DYA package to the data sheet........................................................................................................ 1

ESD321

SLVSEN8C – JULY 2018 – REVISED JUNE 2025

www.ti.com

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