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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STMPE1601 датащи(PDF) 55 Page - STMicroelectronics |
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STMPE1601 датащи(HTML) 55 Page - STMicroelectronics |
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55 / 58 page  STMPE1601 Package mechanical data 55/58 16 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 11. TFBGA25 package outline Table 23. TFBGA25 mechanical data Dim. mm. inch Min Typ Max Min Typ Max A 1.0 1.1 1.16 39.4 43.3 45.7 A1 0.25 9.8 A2 0.78 0.86 30.7 33.9 b 0.25 0.30 0.35 9.8 11.8 13.8 D 2.9 3.0 3.1 114.2 118.1 122.0 D1 2 78.8 E 2.9 3.0 3.1 114.2 118.1 122.0 E1 2 78.8 e 0.5 19.7 SE 0.25 9.8 |
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