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LPV7215

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SNOSAI6J – SEPTEMBER 2005 – REVISED AUGUST 2016

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5 Pin Configuration and Functions

DBV and DCK Package

5-Pin SOT-23 and SC70

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

1

VOUT

O

Output

2

V–

P

Negative Supply

3

VIN+

I

Noninverting Input

4

VIN–

I

Inverting Input

5

V+

P

Positive Supply

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA . All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN differential

−2.5

2.5

V

Supply voltage (V+ - V−)

6

V

Voltage at input and output pins

V−

− 0.3

V+ + 0.3

V

Junction temperature, TJ

(2)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Human-body model, applicable std. MIL-STD-883, Method 3015.7.

(2)

Machine model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-

C101-C (ESD FICDM std. of JEDEC).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM)(1)

±2000

V

Machine model (MM)(2)

±200